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Wafer Bonding
- Fusion Bonding
- Anodic Bonding
- Eutectic Bonding
- Thermocompression Bonding
- Polymer Bonding
Wafer BondingEnestedt Reklambyrå2021-03-10T00:36:50+01:00
Multiple Bonding technologies available
Low temperature wafer level packaging (<300°C)
Functional IR caps with optical coatings, lenses and getter
Solder bonding to accommodate surface topology (e.g. CMOS wafers)
