Wafer Bonding

  • Multiple Bonding technologies available
      • Fusion Bonding
      • Anodic Bonding
      • Eutectic Bonding
      • Thermocompression Bonding
      • Polymer Bonding
  • Low temperature wafer level packaging (<300°C)
  • Functional IR caps with optical coatings, lenses and getter
  • Solder bonding to accommodate surface topology (e.g. CMOS wafers)
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