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TGV
- Low resistance metal through glass via (<10mOhm)
- Gold or Copper metallization
- Enabling technology for glass wafer capping for RF and other applications where low capacitance is key
- Excellent RF feedthrough linearity (better than 78dBm IIP3)
TGVEnestedt Reklambyrå2016-10-21T08:09:52+02:00
