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TGV
Enestedt Reklambyrå
2016-10-21T08:09:52+02:00
TGV
Low resistance metal through glass via (<10mOhm)
Gold or Copper metallization
Enabling technology for glass wafer capping for RF and other applications where low capacitance is key
Excellent RF feedthrough linearity (better than 78dBm IIP3)