Piezo MEMS

  • Sputtered piezoelectric PZT stack process capability including Pt Electrode and ALD Passivation
  • ULVAC SME-200 sputtering system for mass production of MEMS devices
  • PZT and Pt dry Etching
  • System Integration: Wafer Level Bonding, Cavity SOI, TSV
  • Characterization including e31f, C-V, P-V, BDV, XRD, aixacct 4 point bender, Fatigue
  • Highly Accelerated Lifetime Testing – HALT
  • Integration of PZT and Sil-Via ® TSV for use with and type of sensor or microactuator
piezo-mems