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Met-CAP ®
- Cu or Au TSV Capping Technology for Low Resistance applications (<20 mOhm)
- Wafer level packaging of RF switches and other MEMS devices
- Via last enables integration of MEMS and packaging in CMOS wafer
- CMOS compatible eutectic bonding creates a hermetic cap
- Creating complete packaging solution together with solder balls and eutectic bonding
