Met-CAP ®

  • Cu or Au TSV Capping Technology for Low Resistance applications (<20 mOhm)
  • Wafer level packaging of RF switches and other MEMS devices
  • Via last enables integration of MEMS and packaging in CMOS wafer
  • CMOS compatible eutectic bonding creates a hermetic cap
  • Creating complete packaging solution together with solder balls and eutectic bonding