News
Silex Named Elektronik i Norden’s 2012 Electronics Company of the Year
Elektronik i Norden, the Scandinavian source for electronics news and industry analysis, on 22 November named Silex Microsystems AB as the 2012 Electronics Company of the year in a brief [...]
A.M. Fitzgerald & Associates Selects Silex Microsystems’ SmartBlocks™ for Rapid Development of Semi-Custom MEMS Sensors
Collaboration Enables a New Framework for MEMS Development that Reduces Time to Market by Up to One Year Järfälla, Sweden and Burlingame, California, November 7, 2012 – Silex Microsystems, the world’s largest [...]
Silex Microsystems Receives VINNOVA Grant to Expand Volume Production Capabilities for MEMS-based Gas Sensors
Järfälla, Sweden, July 9, 2012 -- Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that VINNOVA, the Swedish Governmental Agency for Innovation Systems, has awarded a nearly 10M [...]
Silex Microsystems Receives VINNOVA Grant to Develop Magnetic MEMS Technology for Next-Generation Smartphone Applications
Silex Microsystems Receives VINNOVA Grant to Develop Magnetic MEMS Technology for Next-Generation Smartphone Applications Award Highlights Silex’s MEMS Expertise and Advanced Met-Via® Technology Enabling Advanced Sensor Capabilities Järfälla, Sweden, April [...]
Yole Développement Ranks Silex Microsystems as the World’s Largest Pure-Play MEMS Foundry
Yole Développement Ranks Silex Microsystems as the World’s Largest Pure-Play MEMS Foundry Silex Achieves 27% Revenue Growth in 2011 Järfälla, Sweden, April 24, 2012 – For the second consecutive [...]
Fredrik Jönsson joins Board of Directors for Silex Microsystems AB
Silex Microsystems Announces New Board Member Fredrik Jönsson joins Board of Directors for Silex Microsystems AB Järfälla, Sweden, April 17, 2012 -- Silex Microsystems, the world’s largest pure-play MEMS [...]
Silex Microsystems Met-Via® Technology Enables Through Mold Via Applications
Silex Microsystems Met-Via® Technology Enables Through Mold Via ApplicationsTechnology Developed for Through-Mold Via (TMV) Capabilities for Biofluidic Sensing As Part of ENIAC Joint Undertaking Project Järfälla, Sweden, April 16, 2012 [...]
Through substrate vias: opportunities for CMOS MEMS and 3D integration
MEMS Investor Journal interviews Tomas Bauer, Silex VP of Sales and Business Development, on the trends and opportunities for TSV based applications. Silex, as one of the industry's leading TSV [...]
Silex Microsystems Joins ENIAC Joint Undertaking Project EPAMO To Develop Advanced RF Solutions for 4G Mobile Systems
Silex Will Develop Innovative Through-Silicon Via, PZT Piezoelectric, and Integrated Passive Device Technologies as Part of This Multi-Company Effort EPAMO Press Release - Swedish version Järfälla, Sweden, January 23, [...]
Silex Via Technology Overview in Korean News
Electronic Times in Korea ran this overview of Silex TSV solutions for MEMS and CMOS packaging in their January edition
