News
Silex RF Capable TSVs Featured in Microwave Journal
Microwave Journal, the standard for the latest in trade news for the microwave and RF space, has published an overview of Silex's TSV technologies and RF characterization work in its [...]
Silex Wins Best Paper Award at IWLPC
SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 [...]
Silex Microsystems Receives VINNOVA Grant for Ground-Breaking New Energy Harvesting Technology
Järfälla, Sweden, December 11, 2013 -- Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has been awarded a grant of nearly $1 million USD (5,8 [...]
AMFitzgerald and Silex Microsystems Achieve Major Milestone with RocketMEMS Program; Working MEMS Sensors Signal Readiness for Commercialization
Järfälla, Sweden and Burlingame, California, November 6, 2013 – Silex Microsystems, a leading pure-play MEMS foundry, and A.M. Fitzgerald & Associates (“AMFitzgerald”), a MEMS product development firm, today announced that [...]
MEMS for Micromachining
Commercial Micro Manufacturing recently interviewed Silex's Tomas Bauer about how MEMS brings new capabilities and enhanced manufacturing options to the world of micromachining. This article is a great overview of [...]
Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process
Järfälla, Sweden, May 13, 2013 -- Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new [...]
Silex and BroadPak Announce Partnership for Advanced 2.5D Interposer Solutions
Silex Microsystems, the world’s largest pure-play MEMS foundry, and BroadPak, a leading provider of ultra-high performance 2.5D silicon interposer and 3D integration technologies, today announced the immediate availability of their [...]
MEMS Journal interviews Silex and AMFitzgerald about RocketMEMS Program
Interest in this new approach toward MEMS design has sparked great interest in the industry. In this article, MEMS Journal interviews Alissa Fitzgerald, Founder and Managing Member of AMFitzgerald & [...]
Silex TSI Technology featured in SolidState Technology
Silex Microsystems' Through-Silicon Insulation or TSI technology was highlighted in the March 2013 issue of SolidState Technology. This article is a great overview of Silex technology and how TSI forms [...]
RocketMEMS Interview on EE Journal’s FishFry
Peter Himes, from Silex Microsystems, and Alissa Fitzgerald of AMFitzgerald & Asociates, were interviewed by Amelia Dalton of EE Journal to discuss the recently announced RocketMEMS program, the new initiative [...]
