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IEEE MEMS 2020, Vancouver, Canada
IEEE MEMS will be in Vancouver this year and Silex will be on site exhibiting and talking to our industry colleagues. The conference is a premier MEMS technology event [...]
03
Jan/20
About Tomas Bauer
This author has not yet filled in any details.So far Tomas Bauer has created 92 blog entries.
11
Feb/16
Silex Hosts Master Class on PiezoMEMS
smart-MEMPHIS EU-project, coordinated by Silex Microsystems, hosts a satellite master class in connection to the PiezoMEMS 2016 conference. The master class is free of charge for Piezo MEMS 2016 participants and [...]
13
Jul/15
New Major Shareholder and Investor in Silex Microsystems
The investment holding company GAE Ltd has acquired 98% of the shares in Silex Microsystems. The transaction took place July 13th 2015 when the former major shareholders CapMan, Priveq, Northzone [...]
10
Mar/15
EU-Funded Project Investigates Energy Harvesting for Self-Powered Pacemakers
Silex has joined eight other European companies, research institutes and universities in the Smart-MEMPHIS project. The objective of the project is to develop new, autonomous modules for energy harvesting. Silex [...]
09
Feb/15
New Silex Introduction Movie
A new company introduction movie is now available for viewing and will give you a short introduction to Silex capabilities and MEMS foundry offer: CLICK HERE
19
Sep/14
Featured Article – MEMS for Mechanical Engineers: 2013 and 2014
Link to: Featured Article in CMM International
11
Jun/14
Silex Microsystems Joins ENIAC Project INCITE to Develop PZT Capability for Advanced Ultrasonic Transducer Manufacture
INCITE Press Release June 2014
05
Jun/14
Silex CEO Interview Featured in the MEMS Journal
MEMS Journal has published an interview with Silex CEO Edvard Kälvesten. http://www.memsjournal.com/2014/06/silex-continues-to-focus-on-tsv-technologies-pure-play-mems-foundry-model.html
27
Feb/14
Silex RF Capable TSVs Featured in Microwave Journal
Microwave Journal, the standard for the latest in trade news for the microwave and RF space, has published an overview of Silex's TSV technologies and RF characterization work in its [...]
23
Jan/14
Silex Wins Best Paper Award at IWLPC
SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 [...]
