Wafer-Level Packaging Symposium – Fremont, California, February 14 to 16

The Wafer-Level Packaging Symposium will take place in Fremont, California, on Tue-Thu February 14 to 16, 2023.  The WLP Symposium will cover all aspects of IC and MEMS device packaging at wafer level, advanced manufacturing & test technologies.

Silex will have a booth at the event to meet anybody interested in learning about our latest advanced packaging methodologies.

For further details and registration go to https://smta.org/mpage/wafer