27 February, 2014

Silex RF Capable TSVs Featured in Microwave Journal

Microwave Journal, the standard for the latest in trade news for the microwave and RF space, has published an overview of Silex’s TSV technologies and RF characterization work in its latest issue. The article, “Through-Silicon Vias and 3D Inductors for RF Applications,” is jointly authored by Dr Thörbjorn Ebefors, co-founder and VP of R&D at Silex Microsystems, and Dr. Joachim Oberhammer, Professor of Engineering at KTH Royal Institute of Technology in Stockholm, Sweden, and reviews the latest developments in the RF space using Silex’s advanced Met-Via(r) TSV technologies.

The full article is available for reading and download.

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