SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 in San Jose. Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best of Conference winner.
The Best of Conference and winner of the 3D track was Jessica Fredlund, Silex Microsystems AB, for her paper, “Recent Results Using Met-Via TSV Interposer Technology as TMV Element in Wafer Level Through Mold Via Packaging of CMOS Biosensors.” Co-authors include Toby Ebefors, Silex Microsystems AB; Erik Jung and Tanja Braun, Ph.D., Fraunhofer IZM.
Congratulations to Jessica for this well deserved recognition!
The full press release by SMTA can be found here, and the paper which was originally published at IWLPC in San Jose, CA in November 2013 is available for download as well.