13 February, 2012

Through substrate vias: opportunities for CMOS MEMS and 3D integration

MEMS Investor Journal interviews Tomas Bauer, Silex VP of Sales and Business Development, on the trends and opportunities for TSV based applications. Silex, as one of the industry’s leading TSV providers with over five year’s experience in production with Sil-Via(r) TSVs, services the MEMS and 3DIC market for TSV based interposer solutions.

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