Semicon China

For the first time, Silex will be exhibiting at Semicon China in Shanghai, March 20-22 2012. Our booth will be in the TSV Pavilion where we will be showcasing our Sil-Via TSV platform and talking to customers about Silex solutions for MEMS, MEMS-CMOS heterogenous packaging, and silicon interposers.

Come see us in Hall E2, Booth 2612