European 3D TSV Summit

Silex Microsystems will be presenting a paper on its latest advancements in 3D TSV technology at the European 3D TSV Summit, being held in Grenoble, France on 22-23 January, 2013. Thorbjorn Ebefors, our head of R&D and one of Silex’s co-founders, will be talking on latest results from our Met-Via technology, and Silex will be present in the exhibitor’s hall as well. Come and see the latest from Silex Microsystems in January!